Preparation and characterization of ultra-thin dicing blades with different bonding properties

Ultra-thin dicing blade is usually used to achieve a high precision cutting in semiconductor back-end packaging and assembly. Lots of interactional parameters involving preparation process bring difficulties qualities good working life blade. In order address these problems, this study prepared three kinds blades characterized the properties blades. It first proposed abrasive exposure coefficient tool deviation provide for force model. Then, experimental apparatus was set up verify And series including feed rate, spindle current, edge chipping coefficient, wear amount, grinding performance are characterize comprehensive Finally, morphology observed under 3D microscope analysis hardness different The theoretical results indicate that model can reflect actual process. There an inverse proportional function between shedding particles from matrix matrix. very dependent on material workpiece. C-dicing presents outstanding effects with small chips self-sharpening properties.